1 sot - 23 cd series 19-aug.-08 document no.32012 small signal switching diode cdbav99/cdbav70/cdbaw56/cdmmbd4148 features silicon epitaxial planar diode smd chip pattern, dual diode with anode to cathode leadfree and rohs compliance components mechanical characteristics size: sot-23 case weight: approx. 21mg marking: bav99 as anode to cathode series dual swit ching diode bav70 as common cathode dual switchin g diode baw56 as common anode dual switching diode bd4148 as sot-23 case single switchin g diode graphic symbol cdbav99 cdbav70 cdbaw56 cdmmbd4148 dimensions dimension/mm SOT-23CD l 3.00.1 w 2.50.1 t 0.850.1 c 0.550.2
2 sot - 23 cd series 19-aug.-08 document no.32012 thermal characteristics 1) parameter at t amb =25 o c 1) symbol value unit 300 mw forward power dissipation power derating above 25 o c p tot 2.4 mw/ o c junction temperature t j 150 o c thermal resistance junction to ambient air r ja 430 o c/w operating& storage temperature range t stg -55 to 150 o c 1) valid provided that electrodes are kept at ambie nt temperature. maximum rating 1) parameter at t amb =25 o c 1) symbol value unit repetitive peak reverse voltage v rrm 70 v non-repetitive peak reverse voltage v rsm 100 v 150 2) ma average rectified current sin half wave rectification with resistive load i f(av) 130 3) ma repetitive peak forward current at t amb =25 c i frm 200 ma non-repetitive surge forward current at t<1s and t j =25 o c 500 ma at t Q 8.3ms and t j =25 o c i fsm 1000 ma 1) valid provided that electrodes are kept at ambient temperature. 2) single diode loader 3) double diode loader electrical characteristics 1) parameter at t amb =25 o c 1) symbol value unit forward voltage at i f =10ma 0.855 max v at i f =100ma v f 1.0 max v leakage current at v r =70v i r 2.5 max ua capacitance at vr=6v,f=1mhz c tot 4 max pf reverse recovery time at vr=6v i f =i r =10ma,r l = 50 t rr 4 max ns 1) valid provided that electrodes are kept at ambie nt temperature.
3 sot - 23 cd series 19-aug.-08 document no.32012 typical characteristics figure 1. forward characteristic figure 2. power de-rating figure 3. forward current d e- rating figure 4. reverse voltage de-rating 0 100 200 300 400 500 0 20 40 60 80 100 120 140 160 180 200 tamb-ambient temperature/oc if/ ma . . 0 50 100 150 200 0 20 40 60 80 100 120 140 160 180 200 tamb-ambient temperature/oc vr/ v . . test characteristics test item test condition requirement solderability sn bath at 2455 o c for 20.5s >95% area tin covered resistance to soldering heat sn bath at 2605 o c for 102s v f ,v z & i r within spec; no mechanical damage humidity steady state at 85 o c 85%rh for 168hrs v f ,v z & i r within spec continue forward operating life at 25 o c i f =1.1i f for 1000hrs v f ,v z & i r within spec thermal shock -55 5 o c/5min to 1505 o c/5min for 10cycles v f ,v z & i r within spec
4 sot - 23 cd series 19-aug.-08 document no.32012 bending strength bending up to 2mm for 1cycle v f ,v z & i r within spec; no mechanical damage applications function: fast switching soldering condition: soldering condition & caution recommended soldering condition (refer to ipc/jedec j-std-020d 4-1&5.2) recommended profile condition sn-pb soldering leadfree soldering wave soldering ramp-up rate (from pre-heat stage) <3 o c/s <3 o c/s t<150 o c pre-heat temperature & time 100-150 o c 60-120s 150-200 o c 60-120s 100-150 o c 60-120s soldering temperature & time 183 o c 60-150s 217 o c 60-150s 2605 o c 52s peak temperature 2305 o c <260 o c 2455 o c <260 o c 2605 o c time within 5 o c of peak temperature 10-20s 20-30s - ramp-down rate <6 o c/s <6 o c/s <6 o c/s time 25 o c to peak temperature <6min <8min - manual soldering: approx. 350 o c for 3s, avoid solder iron tip direct touch the co mponents body recommended soldering profile fig1: reflow soldering profile for lead-free solder (snagcu) t/s t / o c
5 sot - 23 cd series 19-aug.-08 document no.32012 fig2: wave soldering profile *1. the recommended profiles are referring to ipc/j edec j-std-020d & iec-60068-2-58 *2. chip diodes are able to stand maximum soldering temperature up to 260 o c max for 10s, and the soldering cycles with max 3 times, referring to iec -60068-2-58 storage condition: product termination solderabilit y can degrade due to high temperature and humidity or chemical environment. storage condition must be in an ambient temperature of <40 o c and ambient humidity of <75%rh, and free from chemi cal. environmental characteristics hazardous substance or element/ppm pb cd hg cr 6+ pbb pbde product <1000 <100 <1000 <1000 <1000 <1000 halogen substance/ ppm f cl br i total product <900 <900 <900 <900 <1500 packing method t/s t / o c
6 sot - 23 cd series 19-aug.-08 document no.32012 quality/reel reel size tape product 5,000pcs 7 embossed tape disclaimers these products are not designed for use in applicat ions where any failure or malfunction may resulted in personal injury, death or severe property or enviro nmental damage such as medical, military, aircraft,
7 sot - 23 cd series 19-aug.-08 document no.32012 space or life support equipments.
|
